Low-Temperature Sealing Glass

Diemat's glasses are used to hermetically seal optical and semiconductor components without metallization. DM2700 glass seals at temperatures as low as 320 °C in a few seconds. For applications requiring higher operating or processing temperatures, DM2760 seals at 400 °C. DM2995 contains no lead (Pb) and seals at 500 °C. Diemat offers all these glasses in a wide range of preforms. Over 100 pre-tooled preform shapes are available from stock, and custom shapes can be tooled for a modest charge. Diemat's preforms are widely used to seal optical fibers, lenses, windows, and lids in photonic and semiconductor devices and sensors. They replace solder seals at a fraction of the cost, with improved resistance to fatigue, creep, and corrosion. Plating, flux, and atmosphere requirements of solder attach can be eliminated. DM2700 is also available in screen-printable frit paste form to seal lids, lenses and windows and to seal MEMS and other devices at the wafer level. Applications: Sealing of optical fibers in ferrules and tubes (preforms only) Ribbon fiber sealing (preforms only) Sealing lenses in holders or package wall Hermetically sealed patch cords / pigtails Wafer bonding / wafer-level packaging Package lid sealing Via hole sealing Sensor mounting and sealing